Semiconductors are an essential component of all electronic devices; they are the foundation of today’s digital world. Today, the semiconductor industry is facing an unprecedented level of demand driven by the proliferation of Big Data, IoT/IIoT, autonomous vehicles, and 5G.
With the accelerating migration to next-generation technology, and the changes in device architecture relating to both logic and memory (3D NAND and DRAM), an advanced level of control is required to create precise atomic-scale features within every device. Device technologies are continuously evolving to meet the requirements for lower power, higher speed, and smaller form factors.
Comet is the market leader in Vacuum Capacitors and RF Impedance Matching Networks, as well as the sole vertically integrated manufacturer of RF power delivery systems. We offer an advanced intelligent power control that enables the precise plasma performance required for all leading semiconductor applications delivering high-yield, high-quality wafers.
At Comet, our customers are at the core of our business. We’re committed to creating the ultimate customer experience by placing your goals and objectives at the forefront of everything we do.
Deposition is the process of depositing a thin layer of film on the surface of a wafer; the material can be either conducting or insulating.
Plasma is used in key deposition processes including Plasma Enhanced Chemical Vapor Deposition (PECVD) and Physical Vapor Deposition (PVD). For these processes, RF power and matching networks are used to ignite and control the plasma and yield superior results.
Plasma-enabled deposition processes use lower-temperature and higher deposition rates. Well-controlled plasma processes enable high quality uniform film deposition and structure. This results in high yield device manufacturing.
We offer reliable and repeatable solutions with precise power control for today’s leading-edge technology and tomorrow’s new generation of complex semiconductor processes.
Etch is the process of selectively removing unwanted material from the surface of a wafer to create desired features. The process of removing metals is called conductor etch, and the process of removing insulating material is called dielectric etch. Comet offers unique and enabling solutions for both types of etch applications.
In today’s IC manufacturing, virtually all etch processes are done with plasma. Most plasma applications utilize RF power generators and matching networks to ignite and control the plasma. Over the past 30 years there has been a significant increase in the number of plasma process recipe steps and their complexity. In High Aspect Ratio (HAR) features, the etch process demands a precise level of control at every step of the process to create the characteristics of tall, thin features without removing the underlying materials.
Comet has extensive experience with these extremely challenging atomic-level processes, and our technologies enable advanced plasma control technology.
We can create a customized, controlled, and consistent RF power delivery system with a broad frequency and power offering. This allows our customers to precisely control the plasma performance, leading to a high-yield and high-quality wafers.