Designed for the most demanding semiconductor and thin film applications

  • Built for speed, accuracy, precision and repeatability
  • Self-sensing pulsing (no external signals required)
  • Highly optimized drive system with minimal backlash for superior process to process repeatability
  • Frequency tuning supported
  • Optional VI Sensor 

Target market segments

  • Semiconductor – 200 mm / 300 mm
  • FPD – LCD, OLED, Encapsulation
  • MEMS – TSV

Build to print

AGS Matches